Polymer Composite Materials for Semiconductor Optoelectronics and Microelectronics

DOI : http://dx.doi.org/10.13005/bbra/2196

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New alumosilicate filled with aluminum oxyhydroxide (AlO(OH)) is offered as a dielectric substrate (DS) for LED devices. Obtained from these substances the DS have high thermal conductivity up to l = 133.61 W/m×K, whose value depends on the amount of AlO(OH) in the DS. High thermal conductivity is achieved by homogeneous distribution of a large number of AlO(OH) nanosize particles in the crowns of the dendrimer alumosilicate ensembles. The size of the AlO(OH) particles is comparable to that of the voids between the branches in the alumosilicate crowns. As a conductive adhesive for fixing of LED chips on the DS the copolymer of vinyl chloride-maleic anhydride, nanoand microparticles of silver (70 wt. %) composite is offered, the volume resistivity of the wirings being up to 3.1·10-8 Ohm×m. Adhesive strength of the filled alumosilicate (80% of AlO(OH)) applied under shear on the aluminum plate (its roughness to be 11.3 mkm) is 47 N/mm2.

Composite materials; nanostructures; intermolecular interactions; supramolecular structures; sol-gel products; macromolecular conformations; dielectric composition; conductive polymer composition; LED bar