eng Oriental Scientific Publishing Company Biosciences Biotechnology Research Asia 0973-1245 2016-06-13 11 Spl.Edn.2 139 142 10.13005/bbra/1451 12053 article Modeling of Contact Connecting Layer of Compound Rod in Designing of Adhesive and Adhesive Mechanical Joints Maria Yu. Karelina 1 Vjacheslav M. Prikhodko 1 Mikhail I. Semin 1 The Moscow State Automobile and Road Technical University (MADI), 125319, MADI, Leningradsky prospect, building 64, Moscow, Russia. A dynamic analytical model of the compound, which allows taking into account the different types of the non-linearity contact connecting layer. Taking into account the accepted assumptions there longitudinal and bending vibrations of distinctive feature three-layer rod are described. https://www.biotech-asia.org/vol11_nospl_edn2/modeling-of-contact-connecting-layer-of-compound-rod-in-designing-of-adhesive-and-adhesive-mechanical-joints/ Dynamic model of bonded-mechanical compound  Fluctuations differential element contact connecting layer.